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| TECHNICAL DATA KK74HCT10A Triple 3-Input NAND Gate High-Performance Silicon-Gate CMOS The KK74HCT10A is identical in pinout to the LS/ALS10. The KK74HCT10A may be used as a level converter for interfacing TTL or NMOS outputs to High Speed CMOS inputs. * TTL/NMOS Compatible Input Levels * Outputs Directly Interface to CMOS, NMOS, and TTL * Operating Voltage Range: 4.5 to 5.5 V * Low Input Current: 1.0 A ORDERING INFORMATION KK74HCT10AN Plastic KK74HCT10AD SOIC TA = -55 to 125 C for all packages LOGIC DIAGRAM PIN ASSIGNMENT FUNCTION TABLE Inputs A PIN 14 =VCC PIN 7 = GND L X X H B X L X H C X X L H Output Y H H H L X = don't care 1 KK74HCT10A MAXIMUM RATINGS* Symbol VCC VIN VOUT IIN IOUT ICC PD Tstg TL * Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Current, per Pin DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) Value -0.5 to +7.0 -1.5 to VCC +1.5 -0.5 to VCC +0.5 20 25 50 750 500 -65 to +150 260 Unit V V V mA mA mA mW C C Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/C from 65 to 125C SOIC Package: : - 7 mW/C from 65 to 125C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT TA tr, tf Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature, All Package Types Input Rise and Fall Time (Figure 1) Min 4.5 0 -55 0 Max 5.5 VCC +125 500 Unit V V C ns This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND(VIN or VOUT)VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. 2 KK74HCT10A DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol Parameter Test Conditions V Guaranteed Limit 25 C to -55C 2.0 2.0 0.8 0.8 4.4 5.4 3.98 0.1 0.1 0.26 0.1 2.0 85 C 2.0 2.0 0.8 0.8 4.4 5.4 3.84 0.1 0.1 0.33 1.0 20 125 C 2.0 2.0 0.8 0.8 4.4 5.4 3.7 0.1 0.1 0.4 1.0 40 A A V Unit VIH VIL VOH Minimum HighLevel Input Voltage Maximum Low Level Input Voltage Minimum HighLevel Output Voltage VOUT=0.1 V or VCC-0.1 V IOUT 20 A VOUT=0.1 V or VCC-0.1 V IOUT 20 A VIN=VIH or VIL IOUT 20 A VIN=VIH or VIL IOUT 4.0 mA 4.5 5.5 4.5 5.5 4.5 5.5 4.5 4.5 5.5 4.5 5.5 5.5 V V V VOL Maximum LowLevel Output Voltage VIN=VIH IOUT 20 A VIN=VIH IOUT 4.0 mA IIN ICC Maximum Input Leakage Current Maximum Quiescent Supply Current per Package) Additional Quiescent Supply Current VIN=VCC or GND VIN=VCC or GND IOUT=0A VIN = 2.4 V, Any One Input VIN=VCC or GND, Other Inputs IOUT=0A ICC -55C 25C to 125C 2.4 mA 5.5 2.9 3 KK74HCT10A AC ELECTRICAL CHARACTERISTICS (VCC=5.0 V 10%, CL=50pF,Input tr=tf=6.0 ns) Guaranteed Limit Symbol Parameter 25 C to -55C 19 15 10 85C 125C Unit tPLH, tPHL tTLH, tTHL CIN Maximum Propagation Delay, Input A,B or C to Output Y (Figures 1 and 2) Maximum Output Transition Time, Any Output (Figures 1 and 2) Maximum Input Capacitance Power Dissipation Capacitance (Per Gate) 24 19 10 29 22 10 ns ns pF Typical @25C,VCC=5.0 V 27 pF CPD Used to determine the no-load dynamic power consumption: PD=CPDVCC2f+ICCVCC Figure 1. Switching Waveforms Figure 2. Test Circuit EXPANDED LOGIC DIAGRAM (1/3 of the Device) 4 KK74HCT10A N SUFFIX PLASTIC DIP (MS - 001AA) A 14 8 B 1 7 Dimension, mm Symbol A B C MIN 18.67 6.1 MAX 19.69 7.11 5.33 0.36 1.14 2.54 7.62 0 2.92 7.62 0.2 0.38 10 3.81 8.26 0.36 0.56 1.78 F L D F C -T- SEATING N G D 0.25 (0.010) M T K PLANE G H H J M J K L M N NOTES: 1. Dimensions "A", "B" do not include mold flash or protrusions. Maximum mold flash or protrusions 0.25 mm (0.010) per side. D SUFFIX SOIC (MS - 012AB) Dimension, mm 8 A 14 Symbol A MIN 8.55 3.8 1.35 0.33 0.4 1.27 5.27 0 0.1 0.19 5.8 0.25 MAX 8.75 4 1.75 0.51 1.27 H B P B C 1 G 7 C R x 45 D F G -TD 0.25 (0.010) M T C M K SEATING PLANE H J F M J K M P R 8 0.25 0.25 6.2 0.5 NOTES: 1. Dimensions A and B do not include mold flash or protrusion. 2. Maximum mold flash or protrusion 0.15 mm (0.006) per side for A; for B 0.25 mm (0.010) per side. 5 |
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